Smart Connectivity

The drive toward miniaturization in the electronics industry has been particularly rapid over the past two decades. Many applications and products, for instance in the ever-growing field of semiconductor applications, could only be realized due to new fabrication and bonding techniques. Here, laser technology will continue to drive forward technological advancements.

Typical Laser Applications

• Laser cutting of glass, ceramics and plastics, e.g. for housings and other components with no-post-processing of cut edges

• Laser microstructuring of semiconductors, glass, displays and other electronic components

• Laser microdrilling (microvias) of electronic components , e.g. HDI (high density interconnect) circuit boards

• Laser direct structuring e.g. laser pre-treatment of plastic injection molded parts for generating integrated electrical connections and switches for 3D MIDs (molded interconnected devices)

• Laser soldering for selective soldering of electronic components

• Laser marking for environmentally friendly and durable marking of cables, electronic components, PCBs, wafers and numerous other component types and materials

• Laser trimming (laser compensation) of resistors and capacitors