Lasers Facilitate the Future
The electronics industry's drive toward miniaturization has been particularly rapid during the past two decades. Many applications and products only became feasible due to new fabrication and bonding techniques, e.g. laser technology (which will continue its current leading role).
Typical laser applications:
Laser cutting of glass, ceramics and plastics
e.g. for housings and other components with no-post-processing cut edges
of semiconductors, glass, displays and other electronic components
Laser micro-drilling (microvias)
of electronic components , e.g. HDI (high density interconnect) circuit boards
Laser direct structuring
e.g. laser pre-treatment of plastic injection molded parts for generating integrated electrical connections and switches for 3D MIDs (molded interconnected devices)
for selective soldering of electronic components
environmentally friendly and durable marking of cables, electronic components, PCBs, wavers and numerous other component types and materials
Laser trimming (laser compensation)
of resistors and capacitors
Learn more about our scan systems that you can use for the above-mentioned applications.
As an OEM partner, SCANLAB manufactures the core technologies in laser processing machines, but doesn't supply complete systems.