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Press Releases

Jun 18, 2015
New micro processing sub system makes technological leap industrially suitable
SCANLAB AG is introducing a 5-axis micro-processing subsystem to the market. This scanner-based solution enables highly dynamic and precise fabrication of flexibly definable geometries. precSYS's five axes deliver a true technological leap with maximum flexibility and entirely new possibilities to develop and execute processes superior to typical percussion...
May 27, 2015
excelliSCAN brings more productivity to micro-processing
SCANLAB AG is presenting a new high-end scan system at the Laser World of Photonics 2015 tradeshow in Munich, Germany. excelliSCAN utilizes servo innovations to deliver significant productivity gains in numerous industrial applications – e.g. micro-processing. And its optimized mechanical design ensures robustness alongside improved thermal management.
May 21, 2015
Flexible Control Reduces Costs
SCANLAB AG is adding an Ethernet-based product to its proven lineup of RTC controller boards. The new board allows laser-marking-system producers in particular to profit from significantly lowered manufacturing costs for individual workstations, while also providing users with straightforward industrial connectivity. Entire press release as pdf  ...
Feb 26, 2015
Laser Welding Solutions See Strong Asian Growth
SCANLAB AG's subsidiary Blackbird Robotersysteme GmbH announces the establishment of a sales and service center in Shanghai, China. The company's growth strategy and closer proximity to existing customers and installations were key motivators in creating a Chinese subsidiary. On March 1, 2015, Derek Wang will begin organizing the site as Vice President Sales and...
Feb 05, 2015
Accurate, Long-Term-Stable Endurance Runner
SCANLAB AG is introducing a new scan head at the Photonics West tradeshow in San Francisco, USA. The new high-performance intelliSCAN III 20 impresses with exceptional long-term stability – and incredibly low drift. This makes the 20-mm aperture scan head ideally suited for such large-image-field applications as 3D printing and laser cutting.

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